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lite-on dcc release lite-on technology corp. / optoelectronics no.90,chien 1 road, chung ho, new taipei city 23585, taiwan, r.o.c. tel: 886-2-2222-6181 fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto through hole lamp product data sheetLTL1CHJGDNN-042A spec no.: ds20-2015-0112effective date: 05/14/2015revision: - bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4
1 / 10 part no. : ltl 1ch j g dnn - 04 2 a bns - od - fc002/a4 through hole lamp ltl 1c h j g dnn - 0 4 2 a through hole lamp ltl 1 ch j g dnn - 04 2 a rev description by date p001 preliminar y spec ( rdr - 20150031 - 01 ) strong 0 2 / 13 /2015 p00 2 change dimensions on page 2 ,5 jeromy 04/29/2015 above data for pd and customer tracking only - nppr receive and upload on opnc jeromy 05/ 1 3 /2015
2 / 10 part no. : ltl 1ch j g dnn - 04 2 a bns - od - fc002/a4 through hole lamp ltl 1c h j g dnn - 0 4 2 a 1. description through hole leds are offered in a variety of packages such as 3mm, 4mm, 5mm, rectangular, and cylinder which are suitable for all applications requiring status indicati on. several intensity and viewing angle choices are available in each color for design flexibility. 1 . 1. features ? lead (pb) free product rohs compliant. ? low power consumption. ? high efficiency. ? versatile mounting on p.c. board or panel. ? i.c. compatible/lo w current requirement. ? popular t - 1 diameter ? alin gap yellow g reen lamp & green diffused l ens. 1.2 . applications ? communication ? computer ? consumer ? home appliance ? industrial 2 . outline dimensions notes : 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25mm (.010") unless otherwise noted. 3. pro truded resin under flange is 1.0 mm (.0 4 ") max. 4. lead spacing is measured where the leads emerge from the package. 5. specifications are subject to change without notic e.
3 / 10 part no. : ltl 1ch j g dnn - 04 2 a bns - od - fc002/a4 through hole lamp ltl 1c h j g dnn - 0 4 2 a 3 . absolut e maximum ratings at ta = 25 c parameter maximum rating unit power dissipation 75 mw peak forward current (1/10 duty cycle, 0.1ms pulse width) 60 ma dc forward current 30 ma derating linear from 5 0c 0.4 ma/c operating temperature range - 4 0 c to + 100 c storage temperature range - 55c to + 100c lead soldering temperature [ 2.0 mm(.0 787 ") from body] 260c for 5 seconds max. 4. electrical / optical characteristics at ta=25 c parameter symbol min. typ. max. unit test condition luminous intensity i v 50 140 400 mcd i f = 2 0ma , note 1 ,5 viewing angle 2 1/2 45 deg note 2 (fig. 6 ) peak emission wavelength p 575 nm measurement @peak (fig.1) dominant wavelength d 566 572 576 nm note 4 spectral line half - width ? 11 nm forward voltage v f 2. 1 2.4 v i f = 2 0ma reverse current i r 100 a v r = 5v ,note 6 notes : 1. luminous intensity is measured with a light sensor and filter combination that approximates the cie eye - response curve. 2. 1/2 is the off - axis angle at which the luminous intensity is half the axial luminous intensity. 3. i v classification code is marked on each packing bag. 4. the dominant wavelength, d is derived from the cie chromaticity diagram and represents the single wavelength which defines the color of the device. 5. i v guarantee must be included with 15% testing tolerance. 6. reverse voltage (v r ) condition is applied for i r test only. the device is not designed for reverse operation.
4 / 10 part no. : ltl 1ch j g dnn - 04 2 a bns - od - fc002/a4 through hole lamp ltl 1c h j g dnn - 0 4 2 a 5. typical electrical / optical characteristics curves (25 c ambient temperature unless otherwi se noted)
5 / 10 part no. : ltl 1ch j g dnn - 04 2 a bns - od - fc002/a4 through hole lamp ltl 1c h j g dnn - 0 4 2 a 6. taping features * compatible with radial lead automatic insertion equipment. * most radial lead plastic lead lamps available packaged in tape and folding. * 2.54mm (0.1") straight lead spacing available. * fol ding packaging simplifies handling and testing. * reel packaging is available by removing suffix a on option. package dimensions specification item symbol minimum maximum mm inch mm inch tape feed hole diameter d 3.8 0.149 4.2 0.165 component lead pitch f 2.3 0.091 3.0 0.118 front to rear deflection h -- -- 2.0 0.078 feed hole to bottom of component h1 1 8 .5 0. 728 19.5 0.768 feed hole to overall component height h2 23 .4 0.921 25 .0 0.984 lead length after component height l w0 11.0 0.433 feed hole pitch p 12.4 0.488 13.0 0.511 lead location p1 4. 4 0.173 5.8 0.228 center of component location p2 5.05 0.198 7.65 0.301 total taped thickness t -- -- 0.90 0.035 feed hole location w0 8.5 0.334 9.75 0.384 adhesive tape position w2 0 0 3.0 0.118 tape width w3 17.5 0.689 19.0 0.748
6 / 10 part no. : ltl 1ch j g dnn - 04 2 a bns - od - fc002/a4 through hole lamp ltl 1c h j g dnn - 0 4 2 a 7. packing spec. t otal 3,000pcs per inner carton 10 inner cartons per outer carton total 30,000 pcs per outer carton in every shipping lot, only the last pack will be non - full packing
7 / 10 part no. : ltl 1ch j g dnn - 04 2 a bns - od - fc002/a4 through hole lamp ltl 1c h j g dnn - 0 4 2 a 8 . bin table specification luminous intensity unit : mcd @ 2 0ma bin code min . max. cd 5 0 85 ef 85 140 gh 140 240 jk 240 400 note: tolerance of each bin limit is 15% dominant wavelength unit : nm @ 2 0ma bin code min max h06 566.0 568.0 h07 568.0 570.0 h08 570.0 572.0 h09 572.0 574.0 h10 574.0 576.0 note: tolerance of each bin limit is 1nm
8 / 10 part no. : ltl 1ch j g dnn - 04 2 a bns - od - fc002/a4 through hole lamp ltl 1c h j g dnn - 0 4 2 a 9 . cautions 9 . 1. application this led lamp is good for application of indoor and outdoor sign, also ordinary electronic equipment. 9 . 2. storage the storage ambient for the leds should not exceed 30c temperature or 70% relative humidity. it is recommended that leds out of their original packaging are used within three months. for extended storage out of their original packaging, it is recommended that the leds be stored in a sealed container with appropriate des iccant or in desiccators with nitrogen ambient. 9 . 3. cleaning use alcohol - based cleaning solvents such as isopropyl alcohol to clean the leds if necessary. 9 . 4. lead forming & assembly during lead forming, the leads should be bent at a point at least 3mm from the base of led lens. do not use the base of the lead frame as a fulcrum during forming. lead forming must be done before soldering, at normal temperature. during assembly on pcb, use minimum clinch force possible to avoid excessive mechanical stres s. 9 . 5. soldering when soldering, leave a minimum of 2 mm clearance from the base of the lens to the soldering point. dipping the lens into the solder must be avoided. do not apply any external stress to the lead frame during sol dering while the led is at high temperature. recommended soldering conditions: soldering iron wave soldering temperature soldering time position 350c max. 3 seconds max. (one time only) no closer than 2 mm from the base of the epoxy bulb pre - heat pre - heat time solder wave soldering time dipping position 100c max. 60 seconds max. 260c max. 5 seconds max. no lower than 2 mm from the base of the epoxy bulb note: excessive soldering temperature and/or time might result in deformation of the le d lens or catastrophic failure of the led. ir reflow is not suitable process for through hole type led lamp product. 9 . 6. drive method an led is a current - operated device. in order to ensure intensity uniformity on multiple leds connected in parallel in a n application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each led as shown in circuit a below. circuit model ( a ) circuit model ( b ) (a) recommended circuit (b) the brightness of each led might appear different due to the differences in the i - v characteristics of those leds. led led
9 / 10 part no. : ltl 1ch j g dnn - 04 2 a bns - od - fc002/a4 through hole lamp ltl 1c h j g dnn - 0 4 2 a 9 .7. esd (electrostatic discharge) static electricity or power surge will damage the led. suggestions to prevent esd damage: ? use a conductive wrist band or anti - electrostatic glove when handling these leds ? all devices, equipment, and machinery must be properly grounded ? work tables, storage racks, etc. should be properly ground ed ? use ion blower to neutralize the static charge which might have built up on surface of the leds plastic lens as a result of friction between leds during storage and handing suggested checking list : training and certification 9.7. 1 .1 . everyone working i n a static - safe area is esd - certified? 9.7.1. 2. training records kept and re - certification dates monitored? static - safe workstation & work areas 9.7.2.1 . static - safe workstation or work - areas have esd signs? 9.7. 2. 2. all surfaces and objec ts at all static - safe workstation and within 1 ft measure less than 100v? 9.7.2. 3. all ionizer activated, positioned towards the units? 9.7.2. 4. each work surface mats grounding is good? personnel grounding 9.7.3.1 . every person (including visi tors) handling esd sensitive (esds) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 9.7.3.2 . if conductive footwear used, conductive flooring also present where operator stand or walk? 9.7.3.3 . garments, hairs or any thing closer than 1 ft to esd items measure less than 100v*? 9.7.3.4 . every wrist strap or heel strap/conductive shoes checked daily and result recorded for all dls? 9.7.3.5 . all wrist strap or heel strap checkers calibration up to date? note: *50v for blue led. device handling 9.7.4. 1. every esds items identified by eia - 471 labels on item or packaging? 9.7.4. 2. all esds items completely inside properly closed static - shielding containers when not at static - safe workstation? 9.7.4. 3. no static charge generators (e.g. plastics) inside shielding containers with esds items? 9.7.4. 4. all flexible conductive and dissipative package materials inspected before reuse or recycle? others 9.7.5. 1. audit result reported to en tity esd control coordinator? 9.7.5. 2. corrective action from previous audits completed? 9.7.5. 3. are audit records complete and on file?
10 / 10 part no. : ltl 1ch j g dnn - 04 2 a bns - od - fc002/a4 through hole lamp ltl 1c h j g dnn - 0 4 2 a 10 . reliability test classification test item test condition sample size reference standard endurance te st operation life ta = under room temperature if = per datasheet maximum drive current test time= 1000hrs 22 pcs (cl=90%; ltpd= 10 %) mil - std - 750d:1026 (1995) mil - std - 883g:1005 (2006) high temperature high humidity storage ta = 60 c rh = 90 % test ti me= 24 0hrs 22 pcs (cl=90%; ltpd= 10 %) mil - std - 202g:103b (2002) jeita ed - 4701:100 103 (2001) high temperature storage ta= 105 5 c test time= 1000hrs 22 pcs (cl=90%; ltpd= 10 %) mil - std - 750d:1031 (1995) mil - std - 883g:1008 (2006) jeita ed - 4701:200 201 (2001 ) low temperature storage ta= - 55 5 c test time= 1000hrs 22 pcs (cl=90%; ltpd= 10 %) jeita ed - 4701:200 202 (2001) environmental test temperature cycling 100 c 25 c - 40 c 25 c 30mins 5mins 30mins 5mins 3 0 cycles 22 pcs (cl=90%; ltpd= 1 0 %) mil - std - 750d:1051 (1995) mil - std - 883g:1010 (2006) jeita ed - 4701:100 105 (2001) jesd22 - a104c (2005) thermal shock 100 5 c - 30 c 5 c 15mins 15mins 3 0 cycles (<20 secs transfer) 22 pcs (cl=90%; ltpd=10 %) mil - std - 750d:1056 (1995) mi l - std - 883g:1011 (2006) mil - std - 202g:107g (2002) jesd22 - a106b (2004) solder resistance t.sol = 260 5 c dwell time= 101 seconds 3mm from the base of the epoxy bulb 11 pcs (cl=90%; ltpd=18.9%) mil - std - 750d:2031(1995) jeita ed - 4701: 300 302 (2001) solderability t. sol = 245 5 c dwell time= 5 0.5 seconds (lead free solder, coverage R 95% of the dipped surface) 11 pcs (cl=90%; ltpd=18.9%) mil - std - 750d:2026 (1995) mil - std - 883g:2003 (2006) mil - std - 202g:208h (2002) ipc/eia j - std - 002 (2004) soldering iron t. sol = 350 5 c dwell time= 3.5 0.5 seconds 11 pcs (cl=90%; ltpd=18.9%) mil - std - 202g:208h (2002) jeita ed - 4701:300 302 (2001) 1 1 . others the appearance and specifications of the product may be modified for improvement, without prior notice.

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